Thermal Division | Heat Exchangers for Semiconductor Applications
Our Thermal Division focuses on advanced heat exchanger solutions designed to manage heat in high-performance semiconductor applications. Efficient thermal management is critical to reliability, efficiency, and long-term system stability.
OS-MD1010G
Dual-channel low-temperature chiller for semiconductor copper-process applications, providing compact Galden/Fluorinert-compatible cooling with AMAT-CHX interface support.
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OS-C2020
Dual-channel chiller for 200 mm and 300 mm semiconductor tools, providing compact, low-temperature cooling with Galden/Fluorinert compatibility and multiple tool interfaces.
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OS-C20KW
Single-channel chiller for Producer SE semiconductor tools, delivering high-capacity DI/EG cooling with a compact footprint and selectable AMAT interfaces.
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OS-S30KD4
High-capacity heat exchanger for Endura 5500 semiconductor tools, delivering compact DI/EG cooling with high-flow stainless pumping and System III interface compatibility.
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OS-20DS
Single-channel chiller for 200 mm and 300 mm semiconductor tools, providing compact low-temperature DI/EG cooling with selectable LAM, AMAT, Neslab and Shibaura interfaces.
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OS-S40KD
High-temperature multi-channel heat exchanger for 200 mm and 300 mm semiconductor tools, delivering compact DI/EG cooling with high-flow stainless pumping and AMAT interface compatibility.
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OS-3060
Dual-channel chiller designed for 200 mm and 300 mm semiconductor tools, offering precise low-temperature control, compact footprint, and broad interface compatibility.
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OS-R60D
Single-channel high-temperature heat exchanger for 200 mm and 300 mm semiconductor tools, supporting selectable DI/EG, Galden/Fluorinert coolants and multiple OEM interfaces.
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